Our Sn42Bi58 for LED is a typical type of low-temperature lead free solder paste. Its alloy is made up of the 42% tin content and the 58% bismuth content. Its working temperature can be categorized into the preheat temperature from 90℃ to 110℃, the melting point of 138℃, and the reflow temperature from 150℃ to 100℃. It is fit for the demanding reflow-soldering process.
This type of product has passed the SGS test. It also holds numerous certifications, such as RoHS, REACH, and some others. Additionally, it is accompanied with the related material safety data sheet, abbreviated as MSDS. The Sn42Bi58 low temperature lead free solder paste for LED has been exported to such countries as Pakistan, Iran, Colombia, Italy, Spain, Ukraine, Mexico, and more.
Our Sn42Bi58 lead free solder paste is the best choice of repairing the mini-sized electronic equipment. It is also ideal for use in the PCB, SMT, plug-in components, computer motherboards, phone motherboards, LED circuit boards, diversified lighting fixtures, as well as all sorts of high-precision circuit boards.
Technical Data Sheet
|Appearance||Adhesive paste in grayish black|
|Type||Chemical Composition (wt. %)|
Technical Issues and Solutions
Missing Print: The solder cream is not printed on the area that is more than 25% larger than that of the PAD.
1. The mesh may be blocked, or part of the solder cream is adhered to the bottom of the steel mesh. In this case, the bottom of the steel mesh must be cleaned, and the stripping speed is decreased.
2. The steel mesh is short of solder cream, or the tin paste is not well distributed along the direction of width of the scraper. Under the circumstance, the solder cream should be added along the direction of width of the scraper.
3. The viscosity of the solder cream is too high, and the printing effect is not desirable. In this case, the tin paste supplier is requested to provide the solvent. Additionally, please select the proper viscosity of Sn42Bi58 low temperature lead free solder paste for LED.