Keywords: Solder Wire, Solder Bar, Solder Paste, Solder Sphere, Solder Preform, Solder Flux, Blister Package, Jar Package, Solder Powder, Solder Iron...

  • Sn42bi57ag1 low temperature wire
  • Sn42bi57ag1 low temperature wire

Sn42bi57ag1 low temperature wire

Products Details

Sn42Bi57Ag1 lead-free solder wire is made of high-quality and high-purity tin ingots and antimony ingots, supplemented by high-purity silver, and is refined by special techniques using state-of-the-art lead-free solder professional equipment and excellent technology. By adding rare earth elements, the rapid expansion of microcracks in the brittle interface structure is avoided, and the creep fatigue life of the joint is effectively improved. The alloy is reasonable in proportion, and the flux is prepared from high-quality modified resin, organic activator and various additives. It is a lead-free alloy solder wire with excellent welding performance and environmental protection in the lead-free process.

Main Products:




Product Feature

A. The coil is neat, flat, smooth, smooth, and will not tangle when using.

B. The solder flux in solder wire is distributed evenly, continuous and not broken. 

C. The solder wire has excellent electrical conductivity and thermal conductivity, and has strong wetting & fast welding speed.

D. No irritation, less smoke, small splash when welding.

E. Less residue after welding, spread evenly, quick-drying, high surface insulation resistance, stable and reliable electrical performance.

F. Solder wire is green environmental protection products, conformed RoHS environmental protection requirements, etc.


Sn42Bi57Ag1 lead-free alloy tin wire is suitable for soldering of heat sensitive components. It is widely used in staged soldering (secondary soldering) in the electronics industry, TV tuner, fire alarm, temperature control original, lightning protection period, Air conditioner safety protectors and other industries.

Technical Specifications

ItemTechnical DateAdoption Standard
Density(g / cm3)8.56/
Flux Content2.0±0.5IPC-TM-650
Melting Point(℃)138/
Copper MirrorNo penetration corrosionIPC-TM-650 2.3.32
Flux distribution continuityUniform continuity, no breakGB/T 20422-2006 5.7/5.8
CorrosionNo obvious corrosionIPC-TM-650 2.6.15
Halide ContentL1IPC-TM-650 2.3.33
Rate of Expansion(%)≥75%JIS-Z-3197
Residue DrynessThe surface of the flux residue should be free of stickiness and the chalk powder on the surface should be easily removedIPC-TM-650 2.4.47

compositionC.A.S NO.Weight PercentageOSHA PELACGIH TLV STEL
OSHA :US Occupational Safety and Health Administration
TLV:Valve limit        PEL: Permissible exposure limits
STEL: Short-term exposure limits
ACGIH: American Government Industrial Hygiene Association
CAS: Chemical Abstracts Index Number